In the field of bolt-type high-voltage ceramic capacitors, Japan's TDK Corporation employs a single-ceramic-chip structure, utilizing a standard 60mm mold size for epoxy resin encapsulation; their product specifications reach a maximum of 50kV 2100pF (Y5S dielectric). Domestic technologies, conversely, feature internal dual-chip structures-configured in either series or parallel-enabling the production of capacitors with higher voltage and capacitance ratings.
For instance, connecting two chips in series allows for the realization of high voltages such as 80kV, 100kV, and 150kV, while connecting them in parallel enables high capacitance values-such as 5000pF or 8000pF-using Class 1 ceramic dielectrics. The ceramic chips within this structural configuration utilize a copper electrode coating process. Following Japan's Murata Manufacturing's announcement in 2018 that it would discontinue the production of high-voltage bolt-type capacitors, HVC Capacitor entered this market; their products are now utilized in equipment manufactured by companies such as Nikon, Konica Minolta, and GE Healthcare.
Relevant technological R&D efforts include the patent titled "Temperature Control Method for Bolt-Type Capacitors" (CN119806247A), filed by Xinzhengyuan Electronics in 2025; this technology focuses on the monitoring and regulation of the operating temperature of bolt-type capacitors.
